EC464

Electronic Packaging

Pre-Requisite : EC308
Contact Hours and Credits : ( 3 -0- 0 ) 3

Objective : 

To introduce and discuss various issues related to the system packaging.

Topics Covered :

Functions of an Electronic Package, Packaging Hierarchy, IC packaging: MEMS packaging, consumer electronics packaging, medical electronics packaging, Trends, Challenges, Driving Forces on Packaging Technology,  Materials for Microelectronic packaging, Packaging Material Properties, Ceramics, Polymers, and  Metals in Packaging, Material for high density interconnect substrates

Electrical Anatomy of Systems Packaging, Signal Distribution, Power Distribution, Electromagnetic Interference, Design Process Electrical Design: Interconnect Capacitance, Resistance and Inductance fundamentals; Transmission Lines , Clock Distribution, Noise Sources, power Distribution, signal distribution, EMI,  Digital and RF Issues. Processing Technologies, Thin Film deposition, Patterning, Metal to Metal joining.

IC Assembly – Purpose, Requirements, Technologies, Wire bonding, Tape Automated Bonding, Flip Chip, Wafer Level Packaging , reliability, wafer level burn – in and test. Single chip packaging : functions, types, materials processes, properties, characteristics, trends. Multi chip packaging : types, design, comparison, trends.  Passives: discrete, integrated, embedded –encapsulation and sealing : fundamentals, requirements, materials, processes

Printed Circuit Board: Anatomy, CAD tools for PCB design, Standard fabrication, Micro via Boards. Board Assembly: Surface Mount Technology, Through Hole Technology, Process Control and Design challenges. Thermal Management, Heat transfer fundamentals, Thermal conductivity and resistance, Conduction, convection and radiation – Cooling requirements.

Reliability, Basic concepts, Environmental interactions. Thermal mismatch and fatigue – failures – thermo mechanically induced – electrically induced – chemically induced. Electrical Testing: System level electrical testing, Interconnection tests, Active Circuit Testing, Design for Testability. 

Course Outcomes :

  • CO1: Describe the  functions and applications of packages and materials used for packaging
  • CO2: Explain the procedure used for evaluating  the electrical aspects  of packaging including delay, cross talk
  • CO3: Apply the design technique and analyse the electrical characteristics of VLSI  circuits
  • CO4: Describe  about the single chip and multi chip  packages and techniques.
  • CO5: Explain the techniques  for bonding the packages to dies
  • CO6: Explain the technique used for fabrication and characteristics of  single layer and multi layer PCBs and compare their performances
  • CO7: Describe about thermal management techniques for packages and reliability of packages

Text Books:

  • Tummala, Rao R., Fundamentals of Microsystems Packaging, McGraw Hill, 2001.

Reference Books :

  • Blackwell (Ed), The electronic packaging handbook, CRC Press.
  • Tummala, Rao R, Microelectronics packaging handbook, McGraw Hill.
  • Bosshart, Printed Circuit Boards Design and Technology, TataMcGraw Hill.
  • R.G. Kaduskar and V.B. Baru, Electronic Product design, Wiley India, 2011.
  • R.S. Khandpur, Printed Circuit Board, Tata McGraw Hill, 2005.