Thermal Design of Electronic Equipment    3-0-0-3


  • To expose the students to all aspects of electronic equipment and components including electrical, thermal, fluid dynamics and reliability issues.



Packaging Levels, Package Function, Stages in the Development of a Packaging Technology.Packaging of

Electronic Equipment, Components of Electronic Systems, Thermal management in electronic devices - Packaging Trends. Electronic packaging and interconnection technology.

Conduction in Electronic Equipment: Thermal Conductivity, Thermal Resistances, Conductivity in Solids, Conductivity in Fluids, Conduction—Steady State, Conduction in Simple Geometries, Conduction through a Plane Wall, Conduction through Cylinders and Spheres. Conduction—Transient, Lumped Capacitance Method,  Conduction  in  Extended  Surfaces.  Fin  Efficiency,  Fin  Optimization,  Fin  Surface  Efficiency, Thermal Contact Resistance in Electronic Equipment, Discrete Heat Sources and Thermal Spreading.

Fluid Dynamics for Electronic Equipment- Boundary Layer Theory, Turbulent Flow, Loss Coefficients and Dynamic Drag,     Fans and Pumps, Electronic Chassis Flow. Convection Heat Transfer in Electronic Equipment.Natural Convection in Electronic Devices, Overall Heat Transfer Coefficient.Liquid Cooling Systems, Coolant Selection, Pressure Drop and Pump Requirements.Air Cooling System, Induced or Draft Cooling, Selection of Fans and Blowers.

Radiation Heat Transfer in Electronic Equipment, The Electromagnetic Spectrum, Radiation Equations , Stefan-Boltzmann Law, Surface Characteristics, Emittance, Emittance Factor, Emittance from Extended Surface, Absorptance, Reflectance, Specular Reflectance, Heat Transfer with Phase Change. Combined Modes of Heat Transfer for Electronic Equipment, Radiation and Convection in Parallel.

Introduction to Thermal Design of Electronic Equipment. Analysis of Thermal Failure of Electronic Components. Analysis of Thermal Stresses and Strain, Effect of PCB Bending Stiffness on Wire Stresses, Vibration Fatigue in Lead Wires and Solder Joints. Electronics Cooling Methods in Industry. Heat Sinks, Heat Pipes, Heat Pipes in Electronics Cooling, Thermoelectric Cooling, Immersion Cooling, Cooling Techniques for High Density Electronics.


Reference Books

1.   Rao R. Tummala : Fundamentals of Microsystem Packaging, McGraw Hill, 2001.

2.   Richard K. Ulrich &William D. Brown Advanced Electronic Packaging - 2nd Edition : IEEE Press,


3.   Yunus A. Cengel : Heat Transfer – A Practical Approach, McGraw Hill, 2003.



Students are able to

CO1: design of electronic equipment which minimizes the thermal failures and get the knowledge on cooling Techniques.

CO2: design a package which can withstand higher temperature, vibrations and shock.

CO3: understand the fluid dynamics of electronic cooling systems and heat transfer mechanisms

        CO4: appreciate the principle behind heat transfer equipments. CO5: analyse of thermal stress and strain and cooling techniques.