- Departments / Centres
Pre-Requisite : EC308
Contact Hours and Credits : ( 3 -0- 0 ) 3
To introduce and discuss various issues related to the system packaging.
Functions of an Electronic Package, Packaging Hierarchy, IC packaging: MEMS packaging, consumer electronics packaging, medical electronics packaging, Trends, Challenges, Driving Forces on Packaging Technology, Materials for Microelectronic packaging, Packaging Material Properties, Ceramics, Polymers, and Metals in Packaging, Material for high density interconnect substrates
Electrical Anatomy of Systems Packaging, Signal Distribution, Power Distribution, Electromagnetic Interference, Design Process Electrical Design: Interconnect Capacitance, Resistance and Inductance fundamentals; Transmission Lines , Clock Distribution, Noise Sources, power Distribution, signal distribution, EMI, Digital and RF Issues. Processing Technologies, Thin Film deposition, Patterning, Metal to Metal joining.
IC Assembly – Purpose, Requirements, Technologies, Wire bonding, Tape Automated Bonding, Flip Chip, Wafer Level Packaging , reliability, wafer level burn – in and test. Single chip packaging : functions, types, materials processes, properties, characteristics, trends. Multi chip packaging : types, design, comparison, trends. Passives: discrete, integrated, embedded –encapsulation and sealing : fundamentals, requirements, materials, processes
Printed Circuit Board: Anatomy, CAD tools for PCB design, Standard fabrication, Micro via Boards. Board Assembly: Surface Mount Technology, Through Hole Technology, Process Control and Design challenges. Thermal Management, Heat transfer fundamentals, Thermal conductivity and resistance, Conduction, convection and radiation – Cooling requirements.
Reliability, Basic concepts, Environmental interactions. Thermal mismatch and fatigue – failures – thermo mechanically induced – electrically induced – chemically induced. Electrical Testing: System level electrical testing, Interconnection tests, Active Circuit Testing, Design for Testability.